Non-Silicone Liquid Gap Filler

 LiPOLY’s EPDM20-s,EPDM30-s series is silicone free two-part compound fixing glue, which have good fixing ability after curing at room temperature or high temperature. Compared with thermally conductive pad, non-silicon two-part thermal conductive adhesive not only produces low stress, high thermal conductivity, Low viscosity, while also maintains excellent insulation. None low-molecular- weight siloxane volatilization cause no electrical contact failure. It is suitable for optical products or sensitive electronic components. Ideally suited for LiPOLY Smart Dispense Robot which is the best choice for automated dispensing production.

  • EPDM20-s
    Datasheet
  • EPDM30-s
    Datasheet

    • Product Series Introduction

    Due to Internet of Things raise, electrical products has tendency to lighter, also with high power, high-speed, and high density. Because of the high power module pursued lighter, high density, high power, and the design of the chip and component pursued high capability, high baud, high efficiency, cause the waste heat and hotspot temperature rise quickly, which become the problem in desperate need to solve.